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Project description

Project Title: Subretinal Prosthesis Prototype Fabricat
Short description
of project:
Retinal disease, or degeneration of the retinal cells, is exemplified by genetically caused retinitis pigmentosa (RP) and age related macular degeneration (AMD). Age-related blindness has become a critical issue as life expectancies continue to rise.Age-related Macular Degeneration (AMD) is the leading cause of blindness in the developed world These are leading causes of blindness affecting an estimated 1-3 million and 25-30 million people worldwide, respectively. AMD alone will affect three million people in the United States by the year 2020. In addition, the prevalence of RP has been estimated to be approximately 1 in 4000. In Germany alone, about 17,000 people become blind every year, many of them due to degeneration of the photosensitive rod and cone cells by retinitis pigmentosa or macula degeneration. Blindness is one of the most common forms of disability. As AMD progresses, the tissue of the macula is destroyed leading to a complete loss of vision in the center. In the case of RP, early symptoms include night blindness, loss of contrast and steadily diminishing peripheral vision. Both can be traced to degenerating light-sensitive rods and cones in the retina.
The subretinal prosthesis design approach relies on electrically stimulated neurons in the retina that bypass the damaged photoreceptors and directly create visual excitation. The subretinal implant is based on a integrated 3D-IC.
Light detection layer has the silicon nanowires (form factor matching with potential). They have high quantum effects.
Nanophotonic components brought together in the light sensing and electrical stimulation of the implant will be reduced footprint and power consumption.
The electrical stimulation (activation of retinal ganglion cells) is formed with responsive to different light intensities nanowires. CMOS image sensor that can produce power from light. The goal of this work is design and develop a technical prototype of subretinal prosthesis and production.

Work Area of project

Applications:
 

CA1 - High quality, high speed user-centred communications systems

CA2 - Smart-card systems, trusted platforms and secure applications

CA3 - Electronics in transportation for safety and security, environmental protection and communications

CA4 - Healthcare devices and systems

CA5 - Energy-efficient devices and energy control systems

CA6 - Devices and systems for digital entertainment

Technologies:
 

CT1 - Electronic design automation for advanced SoC and SiP design

CT2 - Process development: including next generation CMOS process (more Moore), process options (more than Moore) and heterogeneous systems integration

CT3 - Manufacturing science: cross-cutting technologies, equipment and materials

CT4 - Smart sensor and actuator systems

Searched

Type of partner: Any type
Expertise searched: Key words:
Image sensors, Nanowires, 3D-IC integration, Mems

Detailed description:
We collaborate with EU companies on 3D-IC(photonic layer, readout layer, microelectrode arrays) integration with nanowires photonic layer production.

Contact

Last Name: Akyurek
First Name: Muzaffer
Affiliation: MAKMEMS Mikroelektronik
Department:
Postal Address:
Country:   Turkey
Phone: +90 535 5459599
Fax:
Email: makmer@gmail.com