NEWSLETTER MAY 2001

Trends for the future = challenges for MEDEA+

As the drive towards System on Chip (SoC) continues, there are a number of key challenges that must be addressed. Jean-Pierre Noblanc, Chairman of MEDEA+, discusses how MEDEA+ is focussing on these sometime contentious areas, such as mobile 3G and highlights some of the key success factors that the organisation has identified. He also looks at European alignment with both existing markets and future trends, and how, historically, MEDEA+ is so well suited to deal with the proposed partnerships between system integrators and semiconductor companies.

Challenges within the microelectronics industry primarily come from two sources. The first is the applications that increasingly demand low-cost devices, working more efficiently. The second is the technology that is used to produce these devices. It is, of course, a two way "push-pull" street, as technology can, and invariably does, exceed the actual requirements of systems integrators, allowing them to produce even more sophisticated products.

Important applications on which MEDEA+ focuses are naturally at the top of the agenda of most large semiconductor companies and systems integrators. This includes the evolution of the Internet and high-quality of service communications systems, which will operate in real time and will be secure enough to deal with the requirements of E-business and distributed multimedia applications.

This is closely linked to 3G mobile technology. Although there are naturally major obstacles, the move to UMTS will occur, and European microelectronics manufacturers are working towards making this a reality.

Another focus of MEDEA+ is integrated information, communications and entertainment terminals for the Internet society. This move towards a truly digital generation of highly interactive, easy to use terminals operating converging applications is a long-term challenge for all partners.

The last, and environmentally the most important, application focus of MEDEA+ is automotive. As cars have to become more intelligent and be safer to use, and the move towards electric cars looms, the demand for smart automotive electronics continues to increase.

Technological challenges identified by MEDEA+ include the successful and speedy development of an affordable next generation lithography that will open the era of sub-100nm CMOS technology. Strong co-operation between European equipment and semiconductor companies in research, development and effective implementation are key to maintaining a competitive edge in this crucial area of technology.

Another enabling technology that is being addressed by MEDEA+, is greater integration in ICs and the progression of System on Chip (SoC) solutions. This is closely linked to the requirements of systems integrators, as smaller devices with greater functionality, operating at lower voltages are needed.

Both technological and application orientated projects must feature effective co-operation between system integrators and semiconductor companies. Historically, the first of the European programmes, JESSI, concentrated on deeper co-operation between European semiconductor companies. Later, MEDEA intensified R&D co-operation along the electronics supply chain.

MEDEA+, with its strategic focus on "system innovation on silicon for the e-economy", must now encourage even closer co-operative working practices with the systems houses. A major challenge will be to succeed on agreeing terms on the inevitable movement of 'value add' IP between microelectronics and system companies

One of the key success factors of these relationships that MEDEA+ has already identified is the utilisation of interoperable design tools between partners. This important and necessary progression towards standardisation must be completed if projects underway at different locations are to work properly. This is, of course, a much more effective way of conducting research and development on a global scale.