NEWSLETTER OCTOBER 2003 ELECTRONIC DESIGN AUTOMATION CRUCIAL TO EUROPEAN MICROLECTRONICS LEADERSHIP Second quarter (Q2) revenue figures for the global electronic design automation (EDA) market showed an increase of 8% over the same quarter in 2002 according to the EDA Consortium. Is it an encouraging return to worldwide growth? Not yet worldwide. Some regions, like Asia-Pacific, are showing substantial growth, spendings in Europe however are lagging behind. Sub-micron silicon technology productivity is currently growing at some 61% a year, yet IC designer productivity is increasing at only 21%. This gap must be closed to meet the demand for ICs in mass-market consumer applications ? from mobile phones and automotive electronics to home networks and high bandwidth entertainment systems. MEDEA+ projects are responsible for a number of EDA breakthroughs and are increasingly using the top-down design approach that is essential to make the most of system-on-chip (SoC) devices. The latest edition of the MEDEA+ EDA roadmap, released in mid 2003, identifies three areas on which Europe must focus to improve performance: 1. Accelerating process maturity to reduce time to volume production by increased automation in library production, faster product design and designing for manufacturability; Major efforts are required to meet these challenges, specifically:
The MEDEA+ design automation conference being held in Stuttgart from 4 to 6 November as part of the European EDA Week will reflect on the role EDA must play to increase the competitive position of the European microelectronics industry. It will present innovative results from key MEDEA+ projects in the area of application-oriented SoC design ? including mixed digital and analogue/radio-frequency chips, system level specifications, programmable SoC, embedded SoC software and integration of the design flow. Results will also be discussed in the context of the updated MEDEA+ EDA roadmap, part of the overall effort of MEDEA+ to reach adequate design efficiency and maturity for all the design steps between system level specification and signal integrity solutions. | ||